View ILX548K_47850.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

ILX548K
5340 pixel x 3 line CCD Linear Sensor (Color) For the availability of this product, please contact the sales office.
Description The ILX548K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 600DPI. Features * Number of effective pixels: 16020 pixels (5340 pixels x 3) * Pixel size: 4m x 4m (4m pitch) * Distance between line: 32m (8 lines) * Single-sided readout * Ultra low lag/High sensitivity * Single 12V power supply * Maximum data rate: 5MHz/Color * Input clock pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 22 pin Cer-DIP (400mil) 22 pin Plastic DIP (400mil) Absolute Maximum Ratings * Supply voltage VDD 15 * Operating temperature -10 to +55 Pin Configuration (Top View)
GND RS GND VOUT-G VDD NC NC NC NC NC 2 ROG-B 1 1 1 1 2 3 4 5 6 G R B 7 8 9 10 5340 5340 5340 11 22 CLP 21 GND 20 VOUT-B 19 VOUT-R 18 NC 17 NC Output amplifier Output amplifier Output amplifier 16 NC CLP 15 NC 14 ROG-R 19 VOUT-B 20 13 1 12 ROG-G 3 22
D74 D75
22 pin DIP (Cer-DIP)
22 pin DIP (Plastic)
Block Diagram
12 ROG-G 14 ROG-R 11 ROG-B CCD register Driver CCD register
Read out gate
S5340 D70 D74 D75
Driver
21
CCD register
Read out gate
Read out gate
Driver
S5340 D70 D74 D75
V C
Green
Blue
Red
10 13 1 4 2
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
VOUT-R
VOUT-G
E00429-PS
GND
VDD
RS
1
2
D69 S1
D18 D19
D69 S1
D18 D19
S5340 D70 D69 S1 D18 D19
ILX548K
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol RS GND VOUT-G VDD NC NC NC NC NC 2 ROG-B Description Clock pulse input GND Signal output (green) 12V power supply NC NC NC NC NC Clock pulse input Clock pulse input Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol ROG-G 1 ROG-R NC NC NC NC VOUT-R VOUT-B GND CLP Description Clock pulse input Clock pulse input Clock pulse input NC NC NC NC Signal output (red) Signal output (blue) GND Clock pulse input
Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V
Clock Characteristics Item Input capacity of 1, 2 Input capacity of RS Input capacity of CLP Input capacity of ROG Symbol C1, C2 CRS CCLP CROG Min. -- -- -- -- Typ. 500 10 10 10 Max. -- -- -- -- Unit pF pF pF pF
Clock Frequency Item 1, 2, RS, CLP Symbol f1, f2, fRS, fCLP Min. -- Typ. 1 Max. 5 Unit MHz
Input Clock Pulse Voltage Condition Item 1, 2, RS, CLP, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V
-2-
ILX548K
Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Red Sensitivity Green Blue Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE Zo VOS Min. 1.8 2.1 1.7 -- 2 0.56 0.44 0.57 -- -- -- -- 92 -- -- Typ. 2.7 3.3 2.6 4 2.5 0.93 0.76 0.96 2 4 0.02 25 98 450 7.3 Max. 3.6 4.5 3.5 20 -- -- -- -- 5 12 -- 50 -- -- -- mV mV % mA % V Note 7 -- -- -- Note 8 Note 6 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks
Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of D18, D19 to D67. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G= 500mV (Typ.) PRNU = (VMAX - VMIN)/2 VAVE x 100 [%]
Where the 5340 pixels are divided into blocks of 100, the maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R
Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB.
;; ;
VOUT VOS GND
6. Optical signal accumulated time int stands at 5.5ms. 7. VOUT-G = 500mV (Typ.) 8. Vos is defined as indicated below. VOUT indicates VOUT-R, VOUT-G and VOUT-B.
-3-
Clock Timing Chart 1
ROG
5
0
1
2
3
4
1
5
0
2
5
0
RS
5
D1
D2
D3
D17
D18
D19
D67
D68
D69
S1
S2
S5338
S5339
S5340
D70
D71
D74
VOUT Optical black (50 pixels) Dummy signal (69 pixels)
1-line output period (5415 pixels)
;;; ;
D75 ILX548K
-4-
0
CLP
5
0
Note) The transfer pulses (1, 2) must have more than 5415 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. ROG indicates ROG-R, ROG-G, ROG-B.
5415
ILX548K
Clock Timing Chart 2
t4 t5
ROG t6
t2 t7
1
t1
t3
2
Clock Timing Chart 3
t7 1 t6
2 t9 RS t10
t8 t14 t15
t16 CLP
t17
t13
VOUT
; ;; ;; ;
t11 t12
-5-
ILX548K
Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS pulse rise time RS pulse fall time Signal output delay time CLP pulse high level period CLP pulse timing CLP pulse rise time CLP pulse fall time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 Min. 50 3 1 0 0 0 0 30 0 0 -- -- 40 40 10 0 0 Typ. 100 5 2 5 5 20 20 501 20 20 50 20 100 100 50 20 20 Max. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Unit ns s s ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1 These timing is the recommended condition under fRS = 1MHz.
-6-
Application Circuit
CLP
5.1k VOUT-B
IC1
5.1k VOUT-R
Tr1
ROG-R
1
ROG-G
IC1
Tr1 100 100
100 2 100
100
22 21 NC NC NC GND VOUT-B VOUT-R NC ROG-R 1 CLP
20 19 18 17 14 13 15
16
12 ROG-G
RS
GND
VOUT-G
VDD
NC
NC
NC
NC
NC
2
12V 1 3 2 4 5 6 7
8
9
10
100 100 Tr1 VOUT-G RS 5.1k
2 IC1 IC1: 74AC04 Tr1: 2SC2785 2
100
IC1
0.1F
47F/16V
ROG-B
Data rate fRS = 1MHz
ILX548K
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
ROG-B 11
-7-
ILX548K
Example of Representative Characteristics (VDD = 12V, Ta = 25C)
Spectral sensitivity characteristics (Standard characteristics)
1.0
0.8
Relative sensitivity
0.6
0.4
0.2
0 400
450
500
550 600 Wavelength [nm]
650
700
Dark voltage rate vs. Ambient temperature (Standard characteristics)
100 10
Output voltage rate vs. Integration time (Standard characteristics)
10
Output voltage rate 0 10 20 30 40 50 Ta - Ambient temperature [C] 60
Dark voltage rate
1
1
0.1 -10
0.1 1 5 int - Integration time [ms] 10
Offset level vs. Supply voltage (Standard characteristics)
10 Ta = 25C 8 Vos - Offset level [V] Vos - Offset level [V] 8 10
Offset level vs. Ambient temperature (Standard characteristics)
6
6
4 Vos 0.7 VDD 2
4 Vos 1mV/C Ta 2
0 11.4
12 VDD - Supply voltage [V]
12.6
0 -10
0
10 20 30 40 50 Ta - Ambient temperature [C]
60
-8-
ILX548K
Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm
Upper ceramic layer
;;;; ;;; ;; ; ;; ;; ;;
39N 29N 29N 0.9Nm Lower ceramic layer Low-melting glass (1) (2) (3) (4) Cover glass Plastic portion 39N 29N 29N 0.9Nm Ceramic portion Adhesive (1) (2) (3) (4)
;; ; ;;; ;; ;; ;; ;;; ; ;; ;;; ; ;;;
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass. (6) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (7) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. -9-
ILX548K
3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
- 10 -
ILX548K
Package Outline
Unit: mm
22pin DIP (400mil)
32.0 0.5
6.22 0.5 22
21.36 (4m x 5340Pixels) 12
5.0 0.5
V H 1
No.1 Pixel (Green) 11
(AT STAND OFF)
10.0 0.5
10.16
1. The height from the bottom to the sensor surface is 1.61 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
4.0 0.5
2.54
0.51
0.3
3.4 0.5
2.7
M
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER Cer-DIP TIN PLATING 42 ALLOY 3.0g LS-D15(E)
22pin DIP (400mil)
32.0 0.3 6.22 0.3 22 21.36 (4mX5340Pixels) 12
10.0 0.3
5.0 0.3
V H
No.1 Pixel (Green) 1 11
10.16
1. The height from the bottom to the sensor surface is 1.61 0.3mm.
2.8 0.5
2.1
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
4.0 0.5
2.54
0.51 0.3 M
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER Plastic,Ceramic GOLD PLATING 42ALLOY 2.21g LS-D13-01(E)
- 11 -
0.25
0 to 9
0.25
0 to 9
Sony Corporation

▲Up To Search▲

Price & Availability of ILX548K

	To Download ILX548K Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .